PCB관련 약어를 정리해둔 텍스트.. 공유합니다~
AAGR | Annual Average Growth Rate |
ABS | Acrylonitrile-Butadiene-Styrene(Plastic) |
AC | Alternating Current |
ACA | Anisotropically Conductive Adhesive |
AEC | Architecture, Engineering and Construction |
AGV | Automated Guided Vehicle |
AI | Artificial Intelligence |
AIS | Adhesive Interconnect System |
ANOVA | Analysis of Variance |
ANSI | American National Standards Institute |
AOI | Automated Optical Inspection |
AOQ | Average Outgoing Quality |
APT | Automatically Programmed Tools |
AQL | Acceptable Quality Level |
ARINC | Aeronautical Radio Incorporated |
ASCII | American Standard Code for Information Interchange |
ASIC | Application Specific Integrated Circuit |
ASME | American Society of Mechanical Engineers |
ASPaRC | Ability of Solder Paste to Retain Components |
ASTM | American Society for Testing and Materials |
ATE | Automatic Test Equipment |
ATG | Automatic Test Generation |
ATR | Air Transport Rack |
AVT | Accelerated Vesication Test |
AWG | American Wire Gauge |
BC | Buried Capacitance |
BDMA | Benzyldimethylamine |
BGA | Ball Grid Array |
BITE | Built-In Test Equipment |
BOD | Biochemical Oxygen Demand |
BOM | Bill of Material |
BT | Bismaleimide Triazine |
BTAB | Bumped Tape-Automated Bonding |
C3 | Command,Control and Communicate |
C4 | Controlled Collapse Component Connection |
CAD | Computer-Aided Design |
CAE | Computer-Aided Engineering |
CAF | Cathotic Anionic Filaments |
CAFM | Computer-Aided Facilities Management |
CAGE | Commercial and Government Entity |
CALS | Computer-Aided Acquisition and Logistic Support(DOD) |
CAM | Computer-Aided Manufacturing |
CAPP | Computer-Aided Process Planning |
CAR | Computer-Aided Repair |
CASE | Computer-Aided Software Engineering |
CAT | Computer-Aided Testing |
CBGA | Ceramic Ball Grid Array |
CCAPS | Circuit Card Assembly and Processing System |
CDA | Copper Development Association |
C&E | Cause and Effect |
CFM | Continuous Flow Manufacturing |
CFM | Cubic Feet per Minute |
CIM | Computer-Integrated Manufacturing |
CISC | Complex Instruction Set Computing |
CITIS | Contractor Integrated Technical Information Services |
CMC | Copper Moly Copper |
CMOS | Complimentary Metal-Oxide Semiconductor |
CNC | Computer Numerical Control |
COB | Chip-on-Board |
COD | Consumed Oxygen Demand |
Cp | Capability Performance |
CPL | Capability Performance, Lower |
CPU | Capability Performance, Upper |
CPU | Central Processing Unit(Computer) |
CRT | Cathode-Ray Tube |
CSA | Canadian Standards Agency |
CSG | Constructive Solids Geometry |
CSP | Chip Scale Package |
CTE | Coefficient of Thermal Expansion |
CVS | Cyclic Voltammetry Stripping |
DAB | Designated Audit Body |
DATC | Design Automation Technical Committee (IEEE) |
DBMS | Database Management System |
DC | Direct Current |
DCAS | Defense Contract Administration Service |
DCMA | Defense Contract Management Agency |
DCMC | Defense Contract Management Command |
DESC | Defense Electronics Supply Center |
DFM | Design For Manufacture |
DIM | Data-Information Record |
DIN | Deutsches Institute for Normung |
DIP | Dual-Inline Package |
Dk | Dielectric Constant |
DLA | Defense Logistics Agency (DOD) |
DMA | Direct Memory Access |
DMS | Dynamic Mechanical Spectroscopy |
DMSA | Defense Manufacturers and Suppliers Association |
DNC | Distributed (or Direct) Numerical Control |
DOD | Department of Defense |
DOD | Dissolved Oxygen Demand |
DOE | Design of Experiments |
DOS | Disc Operating System |
DRC | Design Rule Checking |
DRM | Drawing Requirements Manual |
DS | Double-Sided |
DSC | Differential Scanning Calorimetry |
DSP | Digital Signal Processor |
DTP | Diameter True Position |
DVM | Digital Voltmeter |
DXF | Data Exchange Format |
ECAD | Electronic Computer-Aided Design |
ECCB | Electronic Components Certification Board |
ECL | Emitter-Coupled Logic |
ECM | Electronic Countermeasures |
ECN | Engineering Change Notice |
ECO | Engineering Change Order |
ECR | Engineering Change Request |
ED | Electrodeposited |
EDA | Electronic Design Automation |
EDI | Electronic Data Interchange |
EDIF | Electronic Design Interchange Format |
EDM | Electro-Discharge Machining |
EIA | Electronics Industry Association |
EIS | Engineering Information System |
EMC | Electromagnetic Compatibility |
EMF | Electro-Motive Force |
EMI | Electromagnetic Interference |
EMP | Electromagnetic Pulse |
EMPF | Electronics Manufacturing Productivity Facility |
EPA | Environmental Protection Agency |
EPR | Ethylene-Propylene (Copolymer) Resin |
EPT | Ethylene-Propylene Terepolymer |
ESD | Electrostatic Discharge |
ESI | Early Supplier Involvement |
ESR | Equivalent Series Resistance |
ETPC | Electrolytic Tough-Pitch Copper |
FAA | Federal Aviation Administration |
FAR | Failure Analysis Report |
FC-CBGA | Flip Chip Ceramic Ball Grid Array |
FCC | Federal Communications Commission |
FCC | Flat-Conductor Cable |
FC-PBGA | Flip Chip Platic Ball Grid Array |
FEA | Finite-Element Analysis |
FEM | Finite-Element Modeling |
FEP | Fluorinated Ethylene-Propylene (Teflon) |
FET | Field-Effect Transistor |
FMEA | Fault Mode and Effect Analysis |
FPGA | Field Programmable Gate Array |
FPT | Fine-Pitch Technology |
FSCM | Federal Stock Code for Manufacturers |
FTP | File Transfer Protocol |
GaAs | Gallium Arsenide |
GBIB | General Purpose Interface Bus |
GMA | Gas Metal Arc (Welding) |
GTA | Gas Tungsten Arc (Welding) |
GTPBGA | Glob Top Plastic Ball Grid Array |
HASL | Hot Air Solder Level |
HPGL | Hewlett Packard Graphic Language |
HTE | High Temperature Elongation |
HTML | Hypertext Markup Language |
HTTP | Hypertext Transfer Protocol |
I/O | Input/Output (Terminations) |
IC | Integrated Circuit |
ICA | Isotropically Conductive Adhesive |
ICAM | Integrated Computer-Aided Manufacturing |
IDC | Insulation-Displacement Connection |
IEC | International Electrotechnical Commission |
IECQ | International Electronic Component Qualification System |
IEEE | Institute of Electrical and Electronic Engineers |
IEPS | International Electronic Packaging Society |
IGES | Integrated Graphics Exchange System |
ILB | Inner-Lead Bonding (TAB) |
IPM | Inches per Minute |
IR | Infrared |
ISHM | International Society for Hybrid Microelectronics |
ISO | International Standards Organization |
ITT | Inter-Test Time |
JEDEC | Joint Electronic Device Engineering Council |
JIT | Just-in-Time (Manufacturing) |
KGB | Known Good Board |
KGD | Known Good Die |
LAN | Local Area Network |
LCCC | Leadless Ceramic Chip Carrier |
LCD | Liquid Crystal Display |
LDA | Logic Design Automation |
LED | Light-Emitting Diode |
LGA | Lang Grid Array |
LIF | Low Insertion Force |
LMC | Least Material Condition |
LPISM | Liquid Photo-Imageable Solder Mask |
LRU | Lowest Replaceable Unit |
LSI | Large Scale Integration (Integrated Circuit) |
LTCC | Low Temperature Co-fired Ceramic |
MA | Mechanical Advantage |
MAC | Maximum Allowable Concentration |
MAP | Manufacturing Automation Protocol |
MATS | Material Transport Segment |
MCAD | Mechanical Computer Aided Design |
MCAE | Mechanical Computer-Aided Engineering |
MCM | Multichip Module |
MDA | Methylenedianiline |
MEK | Methyl-Ethyl Ketone |
MELF | Metal Electrode Face (Discrete Leadless Component) |
MIBK | Methyl-Isobutyl Ketone |
MIR | Moisture Insulation Resistance |
MITI | Ministry of International Trade and Industry (Japan) |
MLB | Multilayer Board |
MLPWB | Multilayer Printed Wiring Board |
MMC | Maximum Material Condition |
MMIC | Monolithic Microwave Integrated Circuit |
MOS | Metal-Oxide Semiconductor |
MRP | Material Requirement Planning |
MRP II | Manufacturing Resource Planning |
MSDS | Material Safety Data Sheets |
MSI | Medium Scale Integration (Integrated Circuit) |
MTBF | Mean Time Between Failures |
MTTR | Mean Time To Repair |
NADCAP | National Aerospace and Defense Contractors Accreditation Procedures |
NASA | National Aeronautics and Space Administration |
NBR | Nitrile Butadiene-Acrylonitrile Rubber |
NBS | National Bureau of Standards |
NC | Numerical Control |
NDT | Non-Destructive Testing |
NECQ | National Electronics Component Qualification System |
NEMA | National Electrtical Manufacturers Association |
NIST | National Institute for Science and Technology |
NMR | Normal-Mode Rejection |
NSA | National Security Agency |
OA | Organic Acid (flux) |
ODR | Oscillating Disk Rheometer |
OEM | Original Equipment Manufacturer |
OFHC | Oxygen-Free High-Conductivity Copper |
OLB | Outer-Lead Bonding (TAB) |
OSHA | Occupational Safety Hazards Act |
OSI | Open Systems Interconnection |
OSP | Organic Solder Preservative |
P&IA | Packaging and Interconnecting Assembly |
P&IS | Packaging and Interconnecting Structure |
PBGA | Plastic Ball Grid Array |
PBX | Private Branch Exchange |
PC | Personal Computer |
PCA | Printed Circuit Assembly |
PCB | Printed Circuit Board |
PCMCIA | Personal Computer Memory Card International Assoc. |
PDES | Product Data Exchange Specification |
PDL | Page Description Language |
PEM | Plastic Electronic Module |
PGA | Pin Grid Array (Leaded Component Package) |
PHIGS | Programmer's Hierarchical Interface Graphics Standard |
PID | Photo-Imageable Dielectric |
PLCC | Plastic Leaded Chip Carrier |
PLD | Programmable Logic Device |
PPM | Parts Per Million |
PPO | Polyphenylene Oxide |
PPS | Polyphenylene Sulfide (Plastic) |
PRT | Planar Resistor Technology |
PSI | Pounds Per Square Inch |
PT | Positional Tolerance |
PTFE | Polytetrafluoroethylene (Teflon) |
PTH | Plated-Through Hole |
PVC | Polyvinyl Chloride |
PWA | Printed Wiring Assembly |
PWB | Printed Wiring Board |
QFP | Quad FlatPack |
QML | Qualified Manufacturers List |
QPL | Qualified Products List |
QTA | Quick Turn Around |
R | Rosin (flux) |
RA | Rosin Activated (flux) |
RAM | Random Access Memory |
RETMA | Radio Electronics & Television Manufacturers Association |
RFI | Radio-Frequency Interference |
RFP | Request for Proposal |
RFQ | Request for Quote |
RFS | Regardless of Feature Size |
RISC | Reduced Instruction Set Computing |
RMA | Rosin Mildy Activated (flux) |
RMS | Root Mean Square |
ROM | Read Only Memory |
ROM | Rough Order of Magnitude |
RPM | Revolutions Per Minute |
RSS | Ramp Soak Spike |
RwoH | Reliability without Hermeticity |
RTS | Ramp To Spike |
RTV | Room Temperature Vulcanizing |
SAE | Society of Automotive Engineers |
SBU | Sequential Buildup |
SEC | Solvent Extract Conductivity |
SEM | Scanning Electron Microscope |
SEM | Standard Electronic Module (Navy) |
SERA | Sequential Electrochemical Reduction Analysis |
SFM | Surface feet per minute |
SIP | Single Inline Package |
SIR | Surface Insulation Resistance |
SMD | Surface Mount Device |
SMEMA | Surface Mount Equipment Manufacturers Association |
SMOBC | Solder Mask Over Bare Copper |
SMT | Surface Mounting Technology |
SMTA | Surface Mount Technology Association |
SNA | Systems Network Architecture |
SOIC | Small-Outline Integrated Circuit |
SOS | Silicon-on-Sapphire |
SPC | Statistical Process Control |
SPICE | Simulation Program, Integrated Circuit Emphasis |
SQC | Statistical Quality Control |
SQL | Structured Query Language |
SSI | Small-Scale Integration (Integrated Circuit) |
STEP | Standard for Exchange of Product Model Data |
TAB | Tape-Automated Bonding |
T's & C's | Terms and Conditions |
TCE | Thermal Coefficient of Expansion |
TCR | Temperature Coefficient of Resistance |
TDR | Time-Domain Reflectometry |
TEM | Transverse Electromagnetic Mode |
TFA | Tree-based Floorplanning Algorithm |
TFE | Tetrafluoroethylene (Teflon) |
Tg | Glass Transition Temperature |
TGA | Thermo Gravimetric Analysis |
THT | Through-Hole Technology |
TIFF | Tagged Image File Format |
TMA | Thermo Mechanical Analysis |
TO | Transistor Outline |
TOP | Technical and Office Protocol |
TP | True Position |
TQM | Total Quality Management |
TTL | Transistor-Transistor Logic |
UBM | Under Bump Metallization |
UHF | Ultra-High Frequency |
UL | Underwriter's Laboratories |
ULSI | Ultra-Large Scale Integration (Integrated Circuit) |
URL | Uniform Resource Locator |
VAR | Value-Added Reseller |
VHDL | VHSIC Hardware Description Language |
VHF | Very-High Frequency |
VHSIC | Very-High Speed Integrated Circuits |
VLSI | Very-Large Scale Integration (Integrated Circuit) |
VME | Versa-Module Electronic |
VOC | Volatile Organic Compound |
VSAG | VHDL Standardization and Analysis Group (IEEE) |
WIP | Work In Process |
WSI | Wafer-Scale Integration |
WWW | World Wide Web |
WYSIWYG | What You See Is What You Get |
XIP | Execute in Place |
ZAF | Z-Axis Adhesive Film |
ZIF | Zero-Insertion Force |
ZIP | Zigzag Inline Package |
