Via hole에서 나올수 있는 불량총집합

 

 1. PLATING VOID

 2. WEDGE VOID

 3. PLATING CRACK /BARREL CRACK

 4. FOIL CRACK

 5. BURNED PLATING

 6. DELAMINATION

 7. DELAMINATION PINKRING

 8. BLISTERING

 9. CRAZING/MEASLING

10. LAMINATE VOID

11. PREPREG VOID

12. RESIN RECESSION INNERLAYER

13. STRESS CRACK

14. RESIN CRACK

15. FIBREBUNDLE CRACK

16. DRILLING CRACK

17. LIFTED LAND CRACK

18. LIFTED LAND/PAD LIFTED

19. PAD ROTATION

20. PULL AWAY

21. RESIN RECESSION

22. WICKING

23. GLASSFIBRE PROTRUSION

24. BURR

25. NODULE

26. INNERLAYER INCLUSION

27. INNERLAYER SEPARATION

28. ETCHBACK NEGATIVE

29. ETCHBACK POSITIVE

30. SHADOWING

31. NAIL HEADING

32. ARROW HEADING

33. WAVE EXPOSURE

34. WEAVE TEXTURE

 A. UNDERCUT

 B. OUTGROWTH

 C. OVERHANG

간단하면서 많은 불량요소들을 한눈에 볼 수 있습니다.