Solder ball & Void 판정기준
2009.06.10
Solder Ball 판정기준 [IPC-A-610C] - 600㎟ 당 5개 미만 - Diameter 0.13mm Void 판정기준 [IPC-7095] Class Ⅲ Small Void area is <9% Class Ⅱ Medium Void area >9% but <20.25% Class Ⅰ Large Void area >20.25% but <36%
카테고리 없음 2009. 6. 10. 18:53