IPC1 Solder ball & Void 판정기준 Solder Ball 판정기준 [IPC-A-610C] - 600㎟ 당 5개 미만 - Diameter 0.13mm Void 판정기준 [IPC-7095] Class Ⅲ Small Void area is ＜9% Class Ⅱ Medium Void area ＞9% but ＜20.25% Class Ⅰ Large Void area ＞20.25% but ＜36% 2009. 6. 10. 이전 1 다음